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Company Profile |
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Fico is a product division of BE Semiconductor Industries N.V., which is publicly listed as BESI on EURONEXT (Amsterdam, the Netherlands). Fico produces molding systems, trim & form equipment, laser markers, laser deflashers, laser singulation and saw singulation systems for leadframe and array connect substrates.
The Fico molding equipment is used to encapsulate semiconductor devices in epoxy resins to protect them from environmental influences.
With the trim & form equipment, the metallic leads of the encapsulated devices are cut and formed for placement on a printed circuit board or in other sockets. Trimming and forming is the final step in the manufacturing process of a semiconductor. The procedure requires a high degree of precision, particularly with the increasing adoption of smaller devices with thinner and more numerous leads that can easily be misformed or broken during the process.
In the newer generation of semiconductors, using array connect technology, the molded substrates are singulated into individual packages. This can either be done with a saw singulation system or, for irregular shapes or high density products, by means of laser singulation (depaneling).
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Products |
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Fico offers molding, trim & form and singulation systems. The reliable systems can process a wide variety of packages. Automatic as well as manual systems use the same molds or tools. Therefore your process can be optimized without interfering in your production capacity. All systems offer you a low cost of ownership and since no customer uses a standard product, any configuration of the machinery can be created, dedicated to your needs.
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Show Molding systems ›››
Show Trim & Form systems ›››
Show Singulation systems ›››
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Applications |
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| All molding, trim & form and singulation equipment can be used for a wide variety of packages. |
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